Verfügbar 24/7 unter
0755-82798135Energiemanagement – Spezialisiert
Power Management - Spezialisiert
Spezialisierte Power-Management-ICs sind für dedizierte Funktionen wie Leistungssteuerung, Sequenzierung, Überwachung, Schutz und Wandlung ausgelegt, die nicht immer in Standardregler- oder Controller-Kategorien passen. Sie werden häufig in Industrieanlagen, Automobilelektronik, Kommunikationssystemen, Servern, Verbrauchergeräten, Medizintechnik und eingebetteten Anwendungen mit anwendungsspezifischen Stromversorgungslösungen eingesetzt.
TomatoElec ist ein unabhängiger Distributor für elektronische Komponenten und liefert spezialisierte Power-Management-ICs von führenden Herstellern wie Texas Instruments, Analog Devices, STMicroelectronics, onsemi, Infineon, Microchip, Renesas, NXP, Diodes Incorporated und Maxim Integrated. Kunden können in der untenstehenden Produktliste inventory, price, package, specifications, parameters and PDF datasheets prüfen und eine BOM oder RFQ für die Beschaffung spezialisierter Power-Management-ICs einreichen.
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung/Gehäuse | Verpackung | Produktstatus | Anwendungen | Strom - Versorgung | Spannung - Versorgung | Betriebstemperatur | Klasse | Qualifizierung | Montageart | Lieferant Gerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
RN5T568C-E4POWER MANAGEMENT SYSTEM DEVICE F |
0 | - |
|
Datenblatt |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
RN5T568S-E4POWER MANAGEMENT SYSTEM DEVICE F |
0 | - |
|
Datenblatt |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MAX77659AENV+TSINGLE IND PMIC FOR A SWITCHING |
0 | - |
|
Datenblatt |
- | 30-XFBGA, WLBGA | Tape & Reel (TR) | Active | Battery Management | 6µA | 2.7V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 30-WLP (2.37x2.55) |
|
MC33FS4500NAER2SYSTEM BASIS CHIP LINEAR 0.5A V |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MPF5032BMBA0ESR2PMIC 2 BUCKS 2 LDO A1 DIE |
0 | - |
|
Datenblatt |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MFS8630BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM |
0 | - |
|
Datenblatt |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MPF5023AMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 |
0 | - |
|
Datenblatt |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 |
0 | - |
|
Datenblatt |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MD1730-I/M2IC ULTRASOUND IMAGING 36VQFN |
0 | - |
|
Datenblatt |
- | 36-VFQFN Exposed Pad | Tray | Obsolete | Ultrasound Imaging | - | 4.75V ~ 5.25V | 0°C ~ 85°C | - | - | Surface Mount | 36-SQFN (6x6) |
|
MP5505GL-PPOWER MANAGEMENT SPECIALIZED - P |
0 | - |
|
Datenblatt |
- | 20-PowerTFQFN | Tape & Reel (TR) | Not For New Designs | Hard-Disk Drives, Solid State Drives (SSD) | 2mA (Max) | 2.7V ~ 7V | -40°C ~ 125°C | - | - | Surface Mount | 20-QFN (3x4) |
|
ISL6537CRZ-TIC REG/CTRLR ACPI DUAL DDR 28QFN |
0 | - |
|
Datenblatt |
- | 28-VQFN Exposed Pad | Tape & Reel (TR) | Active | Memory, DDR/DDR2 Regulator | 7mA | - | 0°C ~ 70°C | - | - | Surface Mount | 28-QFN (6x6) |
|
ISL6537CRZ-TR5160IC REG/CTRLR ACPI DUAL DDR 28QFN |
0 | - |
|
Datenblatt |
- | 28-VQFN Exposed Pad | Tape & Reel (TR) | Obsolete | Memory, DDR/DDR2 Regulator | 7mA | - | 0°C ~ 70°C | - | - | Surface Mount | 28-QFN (6x6) |
|
SMD IC AXP223SMD IC AXP223 |
0 | - |
|
- |
- | - | Bulk | Active | - | - | - | - | - | - | - | - |
|
MFS8622BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM |
0 | - |
|
Datenblatt |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC33FS4505KAER2SYSTEM BASIS CHIP, LINEAR 0.5A V |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
|
MFS8621BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL |
0 | - |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
|
BH6053GU-E2IC PWR MGMT SW REG 32-VCSP |
0 | - |
|
Datenblatt |
- | 32-VFBGA, CSPBGA | Tape & Reel (TR) | Obsolete | Cellular | 5.7mA | 3V ~ 5.5V | -30°C ~ 75°C (TA) | - | - | Surface Mount | 32-VCSP85H3 (3.54x3.54) |
|
DA9063L-XXHO1ONCE OTP IS FINALIZED, PART BECO |
0 | - |
|
Datenblatt |
- | 100-TFBGA | Tray | Active | Processor | 11mA | 2.8V ~ 5.5V | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | Surface Mount | 100-TFBGA (8x8) |
|
ACT88321VU112SRADV PMIC 3 BUCKS 2 LDOS LOAD BYP |
0 | - |
|
Datenblatt |
ActiveCiPSTM™ | 30-UFBGA, WLCSP | Tape & Reel (TR) | Active | Solid State Drives (SSD) | 260µA | 2.7V ~ 5.5V | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 30-WLCSP (2.18x2.58) |
|
ACT88760-101T5V PMIC FOR NEXT GEN PROCESSORS |
0 | - |
|
Datenblatt |
- | 81-UFBGA, WLCSP | Tape & Reel (TR) | Active | Processor | - | 2.7V ~ 5.5V | - | - | - | Surface Mount | 81-WLCSP (3.78x3.78) |

