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Startseite > Produkte > Steckverbinder, Verbindungselemente > Backplane-Steckverbinder > Hartmetrisch, Standard

Hartmetrisch, Standard

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Anschlussstil	Anzahl der Positionen	Anzahl der geladenen Positionen	Abstand	Anzahl der Reihen	Montageart	Anschluss	Steckerverwendung	Kontaktoberfläche	Kontaktoberfläche Dicke
3M Amphenol ICC (FCI) E Connector Solutions EDAC Inc. HARTING Hirose Electric Co Ltd JAE Electronics KYOCERA AVX Molex Oupiin Sullins Connector Solutions TE Connectivity TE Connectivity Aerospace, Defense and Marine TE Connectivity AMP Connectors TE Connectivity ERNI	* - 203316 207244 500 7200 8014 8071, Kyocera 8072, Kyocera 8077, Kyocera 9111 DIN 41612 ERMET har-bus® HM MetPak™ CP2 MetPak™ HM MetPak™ HSHM Metral® Metral® B Millipacs® MJ06 PCN21 UHM Z-PACK Z-PACK, Eye of the Needle (EON)	- Bag Box Bulk Tape & Reel (TR) Tray Tube	Active Discontinued at Key Obsolete	- Header, Male Pins Header, Male Pins and Blades Plug, Male Pins Receptacle, Female Sockets Receptacle, Female Sockets and Blade Sockets	- A A 11+4 A 11+6 A 22 A 25 A 6+6 AB 19 AB 22 AB 25 B 11 B 12 B 19 B 20 B 22 B 25 B 6 B 8 C C 11 C 25 CL 11 CR 11 D 16 D 22 D 25 DE 25 DG 22 E E 25 F 11 FL 11 FR 11 L LF 2 LF 4 LF 5 M M 11 MONOBLOCK N Type ZD ZD Plus	- 10 100 105 (75 + 30 Ground) 110 110 (88 + 22 Ground) 111 (95 + 16 Ground) 114 (110 + 4 Power) 114 (95 + 19 Ground) 120 120 (110 + 10 Ground) 122 125 125 (110 + 15 Ground) 127 127 (95 + 32 Ground) 128 128 (110 + 18 Ground) 132 (110 + 22 Ground) 133 (95 + 38 Ground) 138 (125 + 13 Ground) 144 146 (110 + 36 Ground) 147 (125 + 22 Ground) 150 150 (125 + 25 Ground) 152 (140 + 12 Power) 154 154 (110 + 44 Ground + 4 Power) 154 (110 + 44 Ground) 16 167 169 (125 + 44 Ground) 175 (125 + 50 Ground) 176 180 (176 + 4 Power) 198 198 (176 +22 Ground) 20 200 200 (176 + 24 Ground) 201 (176 + 25 Ground) 220 220 (176 + 44 Ground) 222 (200 + 22 Ground) 225 (200 + 25 Ground) 244 (200 + 44 Ground) 250 250 (200 + 50 Ground) 264 (220 + 44 Ground) 3 (Power) 30 308 (220 + 88 Ground) 32 35 40 48 50 52 55 56 56 (40 + 16 Ground) 58 (55 + 3 Power) 6 (Power) 60 64 65 66 (55 + 11 Ground) 70 72 75 77 77 (55 + 22 Ground) 8 80 80 (55 + 22 Ground + 3 Power) 85 88 90 95 96 99 (88 + 11 Ground)	- 10 100 104 105 106 107 110 111 112 116 118 122 124 125 127 128 129 136 138 140 144 147 148 150 151 156 157 163 170 172 175 180 190 2 21 218 224 225 232 244 246 248 25 28 30 34 35 37 40 48 5 51 55 56 57 60 61 62 70 73 77 79 80 84 85 90 All	- 0.024" (0.60mm) 0.050" (1.27mm) 0.071" (1.80mm) 0.079" (2.00mm) 0.098" (2.50mm) 0.100" (2.54mm) 0.150" (3.81mm) 0.157" (4.00mm) 0.200" (5.08mm) 0.295" (7.50mm)	- 1 10 12 2 3 4 4 + 1 5 5 + 1 5 + 2 6 7 8 8 + 1 8 + 2 9	- Board Edge, Cutout; Through Hole, Right Angle Board Edge, Through Hole, Right Angle Free Hanging (In-Line) Through Hole Through Hole, Right Angle	- IDC Press-Fit Solder Solder Paste	- Backplane Backplane-to-Daughtercard Compact PCI P3, VME JO CompactPCI CompactPCI Computer Telephony CompactPCI Hot Swap CompactPCI Hot Swap P1 CompactPCI J1/J4 CompactPCI J1/J4/RJ4 CompactPCI J2/J5 CompactPCI J2/J5/RJ2 CompactPCI J3 CompactPCI J3, VME PO CompactPCI J3/J0/RJ3 CompactPCI J4 CompactPCI J5/RJ5 CompactPCI P0/P3 CompactPCI P1/P4 CompactPCI P2 CompactPCI P2/P5 CompactPCI P3 CompactPCI P4 CompactPCI P5 CompactPCI RJ5 CompactPCI, P1 Daughtercard Front Board VME, JO	- Gold Gold or Gold, GXT™ Gold or Gold-Palladium Gold, GXT™ Nickel Tin	- 10.0µin (0.25µm) 15.0µin (0.38µm) 20.0µin (0.51µm) 29.5µin (0.75µm) 3.00µin (0.076µm) 3.94µin (0.10µm) 30.0µin (0.76µm) 31.5µin (0.80µm) 39.4µin (1.00µm) 49.3µin (1.25µm) 5.00µin (0.127µm) 50.0µin (1.27µm) 50.0µin (1.27µm) Inner, 30.0µin (0.76µm) Outer 51.2µin (1.30µm) 59.0µin (1.50µm) 98.4µin (2.50µm) Flash

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