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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
40-6553-18

40-6553-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
7100265144

7100265144

TEXTOOLTEST AND BURN-IN BALL GRI

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
361-PLS19001-12

361-PLS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
361-PLS19001-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7010293840

7010293840

TEXTOOL1021-2-0400-0B-00L36=1.0M

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
200-6325-9UN-1900

200-6325-9UN-1900

CONN SOCKET PGA ZIF 625POS GOLD

3M

0 -
RFQ
200-6325-9UN-1900

Datenblatt

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
336-PLS20019-12

336-PLS20019-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PLS20019-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
336-PLS20021-12

336-PLS20021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PLS20021-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
336-PRS20019-12

336-PRS20019-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PRS20019-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
336-PRS20021-12

336-PRS20021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PRS20021-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
42-3551-18

42-3551-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
42-3552-18

42-3552-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
42-3553-18

42-3553-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
42-6552-18

42-6552-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
36-3575-18

36-3575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-3575-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
336-PLS21022-12

336-PLS21022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PLS21022-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100285425

7100285425

TEXTOOLTEST & BURN-IN BALL GRID

3M

0 -
RFQ
7100285425

Datenblatt

- Bulk Active - - - - - - - - - - - - - - -
7010297751

7010297751

TEXTOOL1019-1-0484-0B-02L25

3M

0 -
RFQ
7010297751

Datenblatt

- Bulk Active - - - - - - - - - - - - - - -
42-3574-18

42-3574-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
RFQ
42-3574-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3575-18

42-3575-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
RFQ
42-3575-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6574-18

42-6574-18

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
RFQ
42-6574-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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