IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
1981837-2

1981837-2

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1981837-2

Datenblatt

- Tray Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - Copper Alloy Thermoplastic -
APA-316-G-N

APA-316-G-N

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-316-G-N

Datenblatt

APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICO-640-MGT

ICO-640-MGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-640-MGT

Datenblatt

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
101-93-422-41-560000

101-93-422-41-560000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

486 -
RFQ
101-93-422-41-560000

Datenblatt

101 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-420-41-001000

110-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

538 -
RFQ
110-93-420-41-001000

Datenblatt

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

300 -
RFQ
299-43-632-10-002000

Datenblatt

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-424-41-003000

115-43-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

488 -
RFQ
115-43-424-41-003000

Datenblatt

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-640-S-O-TR

ICF-640-S-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-640-S-O-TR

Datenblatt

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICO-640-NGT

ICO-640-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-640-NGT

Datenblatt

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-93-318-41-007000

116-93-318-41-007000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

892 -
RFQ
116-93-318-41-007000

Datenblatt

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8059-2G5

8059-2G5

CONN SOCKET TRANSIST TO-5 8POS

TE Connectivity AMP Connectors

0 -
RFQ
8059-2G5

Datenblatt

- Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Copper Alloy Through Hole Closed Frame Solder - Gold - Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
2-1437531-2

2-1437531-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1437531-2

Datenblatt

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
117-93-628-41-005000

117-93-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

193 -
RFQ
117-93-628-41-005000

Datenblatt

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1437508-1

3-1437508-1

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1437508-1

Datenblatt

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
2-822114-3

2-822114-3

CONN SOCKET PQFP 144POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ
2-822114-3

Datenblatt

- Tube Obsolete QFP 144 (4 x 36) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
2201838-2

2201838-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2201838-2

Datenblatt

- Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
2201838-1

2201838-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2201838-1

Datenblatt

- Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
ASPI0002-P001A

ASPI0002-P001A

SPI 8Pin WSON 8X6

LOTES

3,430 -
RFQ
ASPI0002-P001A

Datenblatt

- Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold Flash Phosphor Bronze Liquid Crystal Polymer (LCP) -
ASPI0001-P001A

ASPI0001-P001A

SPI 8 PIN_IC 150mil

LOTES

1,710 -
RFQ
ASPI0001-P001A

Datenblatt

- Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
ACA-SPI-004-K01

ACA-SPI-004-K01

SPI 8 PIN_IC 208mil

LOTES

1,660 -
RFQ
ACA-SPI-004-K01

Datenblatt

- Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
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